Quantifying carrier recombination at grain boundaries in multicrystalline silicon wafers through photoluminescence imaging
Crossref DOI link: https://doi.org/10.1063/1.4904963
Published Online: 2014-12-29
Published Print: 2014-12-28
Update policy: https://doi.org/10.1063/aip-crossmark-policy-page
Sio, H. C.
Trupke, T.
Macdonald, D.
Funding for this research was provided by:
Australian Renewable Energy Agency
BT Imaging