Three-dimensional micro-Raman spectroscopy mapping of stress induced in Si by Cu-filled through-Si vias
Crossref DOI link: https://doi.org/10.1063/1.4921004
Published Online: 2015-05-11
Published Print: 2015-05-11
Update policy: https://doi.org/10.1063/aip-crossmark-policy-page
Kosemura, Daisuke
De Wolf, Ingrid http://orcid.org/0000-0003-3822-5953
Funding for this research was provided by:
Japan Society for the Promotion of Science