Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects
Crossref DOI link: https://doi.org/10.1063/1.4975305
Published Online: 2017-02-02
Published Print: 2017-01-30
Update policy: https://doi.org/10.1063/aip-crossmark-policy-page
Ross, G. http://orcid.org/0000-0003-3923-6830
Vuorinen, V.
Petzold, M.
Paulasto-Kröckel, M.
Brand, S.
Funding for this research was provided by:
Lab4MEMS II (2013-2- 621176)
Metro43D (688225)