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A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications

Crossref DOI link: https://doi.org/10.1039/C6LC01319H

Published Online: 2017

Update policy: https://doi.org/10.1039/rsc_crossmark_policy

Authors

Serra, M.

Pereiro, I. https://orcid.org/0000-0003-3490-5978
Yamada, A.

Viovy, J.-L.

Descroix, S.

Ferraro, D.
Funding

Funding for this research was provided by:

Agence Nationale de la Recherche (ANR 10-NANO 0207)

European Research Council (FP7-IDEAS-ERC-321107)
More Information

SIMILARITY CHECK

: This document is Similarity Check deposited

RELATED DATA

: Supplementary Information

IDENTIFIERS

: I. Pereiro (ORCID)

COPYRIGHT AND LICENSING

: The Royal Society of Chemistry has an exclusive publication licence for this journal

OPEN ACCESS: This article is freely available. This article is licensed under a Creative Commons Attribution Non Commercial 3.0 Unported Licence (CC BY-NC 3.0)

PEER REVIEW METHOD

: Single-blind

PUBLICATION HISTORY

: Received 24 October 2016; Accepted 15 January 2017; Accepted Manuscript published 16 January 2017; Advance Article published 23 January 2017; Version of Record published 14 February 2017