Crossmark

Self-catalyzed copper–silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper–silver hybrid tracks at a low temperature below 100 °C

Crossref DOI link: https://doi.org/10.1039/C7NR09225C

Published Online: 2018

Update policy: https://doi.org/10.1039/rsc_crossmark_policy

Authors

Li, Wanli https://orcid.org/0000-0003-0271-5782
Li, Cai-Fu

Lang, Fengpei

Jiu, Jinting

Ueshima, Minoru

Wang, Hao

Liu, Zhi-Quan

Suganuma, Katsuaki
Funding

Funding for this research was provided by:

China Scholarship Council (201506250069)

Advanced Low Carbon Technology Research and Development Program (J165101047)

Osaka University (J135104902)
License Information

Accepted Manuscript valid from 2019-02-08
More Information

SIMILARITY CHECK

: This document is Similarity Check deposited

RELATED DATA

: Supplementary Information

IDENTIFIERS

: Wanli Li (ORCID)

PEER REVIEW METHOD

: Single-blind

PUBLICATION HISTORY

: Received 12 December 2017; Accepted 8 February 2018; Accepted Manuscript published 8 February 2018; Advance Article published 2 March 2018; Version of Record published 15 March 2018

Document is current

Any future updates will be listed below