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A reversible and highly conductive adhesive: towards self-healing and recyclable flexible electronics

Published Online: 2020

Authors

Yan, Qiming

Zhou, Meng

Fu, Heqing https://orcid.org/0000-0002-1298-8306
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (21878108)
License Information

Accepted Manuscript valid from 2021-04-27
More Information

SIMILARITY CHECK

: This document is Similarity Check deposited

RELATED DATA

: Supplementary Information

IDENTIFIERS

: Heqing Fu (ORCID)

PEER REVIEW METHOD

: Single-blind

PUBLICATION HISTORY

: Received 11 December 2019; Accepted 25 April 2020; Accepted Manuscript published 27 April 2020; Advance Article published 12 May 2020; Version of Record published 18 June 2020

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