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The effect of post-deposition annealing conditions on structural and thermoelectric properties of sputtered copper oxide films

Crossref DOI link: https://doi.org/10.1039/D0RA03906C

Published Online: 2020

Update policy: https://doi.org/10.1039/rsc_crossmark_policy

Authors

Abinaya, Chandrasekaran

Bethke, Kevin https://orcid.org/0000-0002-0528-8635
Andrei, Virgil https://orcid.org/0000-0002-6914-4841
Baumann, Jonas https://orcid.org/0000-0002-1085-9527
Pollakowski-Herrmann, Beatrix

Kanngießer, Birgit

Beckhoff, Burkhard

Vásquez, G. Cristian

Mayandi, Jeyanthinath https://orcid.org/0000-0002-3218-1681
Finstad, Terje G.

Rademann, Klaus https://orcid.org/0000-0003-3084-3917
Funding

Funding for this research was provided by:

Deutscher Akademischer Austauschdienst (DST/INT/FRG/DAAD/P-29/2017)

Bayer-Stiftungen

Deutsche Forschungsgemeinschaft

Norges Forskningsråd (245963, 251131)

Department of Science and Technology, Ministry of Science and Technology, India (DST/INT/FRG/DAAD/P-29/2017)
License Information

Version of Record valid from 2020-08-12
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SIMILARITY CHECK

: This document is Similarity Check deposited

IDENTIFIERS

: Kevin Bethke (ORCID)

: Virgil Andrei (ORCID)

: Jonas Baumann (ORCID)

: Jeyanthinath Mayandi (ORCID)

: Jeyanthinath Mayandi (ResearcherID)

: Klaus Rademann (ORCID)

PEER REVIEW METHOD

: Single-blind

PUBLICATION HISTORY

: Received 30 April 2020; Accepted 13 July 2020; Version of Record published 12 August 2020