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Intrinsic lamellar defects containing atomic Cu in Cu<sub>2</sub>X (X = S, Se) thermoelectric materials

Published Online: 2021

Authors

Wei, Yuyu https://orcid.org/0000-0002-1974-8575
Lu, Ping https://orcid.org/0000-0001-7262-6174
Zhu, Chenxi https://orcid.org/0000-0001-7937-3624
Zhao, Kunpeng https://orcid.org/0000-0002-9977-3139
Lu, Xiaoyue

Su, Hong

Shi, Xun https://orcid.org/0000-0002-8086-6407
Chen, Lidong https://orcid.org/0000-0002-9683-037X
Xu, Fangfang https://orcid.org/0000-0002-5570-4289
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51625205, 51672296, 51902199, 52072388)
License Information

Accepted Manuscript valid from 2022-02-26
More Information

SIMILARITY CHECK

: This document is Similarity Check deposited

RELATED DATA

: Supplementary Information

IDENTIFIERS

: Yuyu Wei (ORCID)

: Ping Lu (ORCID)

: Chenxi Zhu (ORCID)

: Kunpeng Zhao (ORCID)

: Xun Shi (ORCID)

: Lidong Chen (ORCID)

: Fangfang Xu (ORCID)

PEER REVIEW METHOD

: Single-blind

PUBLICATION HISTORY

: Received 3 February 2021; Accepted 25 February 2021; Accepted Manuscript published 26 February 2021; Advance Article published 15 March 2021; Version of Record published 1 April 2021

Document is current