Crossmark

Intrinsic lamellar defects containing atomic Cu in Cu<sub>2</sub>X (X = S, Se) thermoelectric materials

Crossref DOI link: https://doi.org/10.1039/D1TC00535A

Published Online: 2021

Update policy: https://doi.org/10.1039/rsc_crossmark_policy

Authors

Wei, Yuyu https://orcid.org/0000-0002-1974-8575
Lu, Ping https://orcid.org/0000-0001-7262-6174
Zhu, Chenxi https://orcid.org/0000-0001-7937-3624
Zhao, Kunpeng https://orcid.org/0000-0002-9977-3139
Lu, Xiaoyue

Su, Hong

Shi, Xun https://orcid.org/0000-0002-8086-6407
Chen, Lidong https://orcid.org/0000-0002-9683-037X
Xu, Fangfang https://orcid.org/0000-0002-5570-4289
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51625205)

National Natural Science Foundation of China (51672296)

National Natural Science Foundation of China (51902199)

National Natural Science Foundation of China (52072388)
License Information

Accepted Manuscript valid from 2022-02-26
More Information

SIMILARITY CHECK

: This document is Similarity Check deposited

RELATED DATA

: Supplementary Information

IDENTIFIERS

: Yuyu Wei (ORCID)

: Ping Lu (ORCID)

: Chenxi Zhu (ORCID)

: Kunpeng Zhao (ORCID)

: Xun Shi (ORCID)

: Lidong Chen (ORCID)

: Fangfang Xu (ORCID)

PEER REVIEW METHOD

: Single-blind

PUBLICATION HISTORY

: Received 3 February 2021; Accepted 25 February 2021; Accepted Manuscript published 26 February 2021; Advance Article published 15 March 2021; Version of Record published 1 April 2021