All-carbocycle hydrocarbon thermosets with high thermal stability and robust mechanical strength for low-<i>k</i>interlayer dielectrics
Crossref DOI link: https://doi.org/10.1039/D1PY00877C
Published Online: 2021
Update policy: https://doi.org/10.1039/rsc_crossmark_policy
Feng, Yudi
Jin, Ke
Guo, Jia https://orcid.org/0000-0003-4869-9992
Wang, Changchun https://orcid.org/0000-0003-3183-2160
Funding for this research was provided by:
National Natural Science Foundation of China (51633001, 51873040, 51721002)
Accepted Manuscript valid from 2022-07-30
