Debonding-on-demand adhesives for recycling and reusing of electronic devices
Crossref DOI link: https://doi.org/10.1039/D5MH00468C
Published Online: 2025
Update policy: https://doi.org/10.1039/rsc_crossmark_policy
Kim, Daewhan
Park, Youngjoo
Kwon, Min Sang https://orcid.org/0000-0002-1485-7588
Funding for this research was provided by:
Ministry of Trade, Industry and Energy (RS202400419769)
Accepted Manuscript valid from 2026-05-28
