Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current
Crossref DOI link: https://doi.org/10.1007/s10854-017-8464-3
Published Online: 2017-12-27
Published Print: 2018-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhu, Q. S.
Gao, F.
Ma, H. C.
Liu, Z. Q.
Guo, J. D.
Zhang, L.
Funding for this research was provided by:
National Natural Science Foundation of China (NSFC) (51471180, 51101161)
Science and Technology Program of Shenyang (F16-205-1-18)
License valid from 2017-12-27