Investigations on brittle-ductile cutting transition and crack formation in diamond cutting of mono-crystalline silicon
Crossref DOI link: https://doi.org/10.1007/s00170-017-1108-1
Published Online: 2017-10-23
Published Print: 2018-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Haitao
Xie, Wenkun
Sun, Yazhou
Zhu, Xiufu
Wang, Minghai
Funding for this research was provided by:
National Natural Science Foundation of China (51475108, 51675352)
License valid from 2017-10-23