Smoothing effect of the thermal interface material on the temperature distribution in a stepwise varying width microchannel cooling device
Crossref DOI link: https://doi.org/10.1007/s00231-017-2045-0
Published Online: 2017-04-10
Published Print: 2017-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Riera, Sara
Barrau, Jérôme http://orcid.org/0000-0002-2601-9856
Rosell, Joan I.
Fréchette, Luc G.
Omri, Mohamed
Vilarrubí, Montse
Laguna, Gerard
License valid from 2017-04-10