Stress distribution affected by nanostructures near a surface crack on a silicon chip
Crossref DOI link: https://doi.org/10.1007/s00707-015-1516-y
Published Online: 2015-12-24
Published Print: 2017-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yeh, Meng-Kao
Shao, Yi-Kung
Yeh, J. Andrew
Hsu, Chuck
Funding for this research was provided by:
National Science Council Taiwan (NSC 102-2221-E-007-030-MY3, NSC 102-2120-M-007-001-CC2)
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