Microstructural model in COMSOL packages with simulation to aging behavior of paper materials
Crossref DOI link: https://doi.org/10.1007/s10570-018-1682-x
Published Online: 2018-02-07
Published Print: 2018-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jiang, Fuze
Weng, Jiajia
Jia, Minghao
Yang, Youdi
Zhang, Xiaogang
Text and Data Mining valid from 2018-02-07
Article History
Received: 6 May 2017
Accepted: 29 January 2018
First Online: 7 February 2018