Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics
Crossref DOI link: https://doi.org/10.1007/s10853-017-1689-y
Published Online: 2017-10-12
Published Print: 2018-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wu, Jiaqi
Lee, Chin C.
License valid from 2017-10-12