Thermal stability of low-temperature sintered joint using Sn-coated Cu particles during isothermal aging at 250 °C
Crossref DOI link: https://doi.org/10.1007/s10854-017-7085-1
Published Online: 2017-05-13
Published Print: 2017-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Xiangdong http://orcid.org/0000-0002-6540-9734
Zhou, Shiqi
Nishikawa, Hiroshi
License valid from 2017-05-13