Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal aging
Crossref DOI link: https://doi.org/10.1007/s10854-017-7086-0
Published Online: 2017-05-17
Published Print: 2017-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Pun, Kelvin P. L.
Islam, M. N.
Cheung, Chee Wah
Chan, Alan H. S.
License valid from 2017-05-17