Effect of deep cryogenic treatment on mechanical properties and microstructure of Sn3.0Ag0.5Cu solder
Crossref DOI link: https://doi.org/10.1007/s10854-017-8400-6
Published Online: 2017-12-09
Published Print: 2018-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yao, Yao
Li, Xiao
He, Xu
Funding for this research was provided by:
National Natural Science Foundation of China (11572249, 11772257)
License valid from 2017-12-09