Rheological characterization and jet printing performance of Sn–58Bi solder pastes
Crossref DOI link: https://doi.org/10.1007/s10854-017-8408-y
Published Online: 2017-12-13
Published Print: 2018-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Saipeng
Wei, Mingzhen
Hao, Jian
Tian, Shuang
Wang, Dapeng
Zhou, Jian http://orcid.org/0000-0003-4166-2564
Xue, Feng
Funding for this research was provided by:
National Natural Science Foundation of China (51004039)
License valid from 2017-12-13