Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-017-8426-9
Published Online: 2017-12-20
Published Print: 2018-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yoon, Jeong-Won
Back, Jong-Hoon
Jung, Seung-Boo
Funding for this research was provided by:
Ministry of Trade, Industry and Energy (10062737)
License valid from 2017-12-20