Method to determine thermoelastic material properties of constituent and copper-patterned layers of multilayer printed circuit boards
Crossref DOI link: https://doi.org/10.1007/s10854-017-8449-2
Published Online: 2018-01-04
Published Print: 2018-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Veldhuijzen van Zanten, J. F. J.
Schuerink, G. A.
Tullemans, A. H. J.
Legtenberg, R.
Wits, Wessel W. http://orcid.org/0000-0002-5102-5545
Funding for this research was provided by:
VSNU Vereniging van Universiteiten
License valid from 2018-01-04