A Comparative Study on the Microstructure and Mechanical Properties of Cu6Sn5 and Cu3Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves
Crossref DOI link: https://doi.org/10.1007/s11661-018-4664-6
Published Online: 2018-05-10
Published Print: 2018-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhao, H. Y.
Liu, J. H.
Li, Z. L.
Song, X. G.
Zhao, Y. X.
Niu, H. W.
Tian, H.
Dong, H. J.
Feng, J. C.
Text and Data Mining valid from 2018-05-10
Version of Record valid from 2018-05-10
Article History
Received: 14 December 2017
First Online: 10 May 2018