Effect of processing conditions on the microencapsulation of 1-methylimidazole curing agent using solid epoxy resins
Crossref DOI link: https://doi.org/10.1007/s13726-017-0548-7
Published Online: 2017-07-25
Published Print: 2017-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mozaffari, Sayed Morteza
Beheshty, Mohammad Hosain
Mirabedini, Sayed Mojtaba
License valid from 2017-07-25