Influence of thermal shock and environment temperature on mechanical properties of C/SiC/GH783 joint brazed with Cu-Ti + Mo
Crossref DOI link: https://doi.org/10.1007/s42114-017-0010-5
Published Online: 2017-10-13
Published Print: 2018-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Deng, Juanli
Zheng, Bohan
Fan, Shangwu
Wang, Xing
Zhang, Litong
Cheng, Laifei
License valid from 2017-10-13