Wang, Jing
Chen, Guang
Sun, Fulong
Zhou, Zhaoxia
Liu, Zhi-Quan
Liu, Changqing
Funding for this research was provided by:
Huawei Technologies Ltd., Shenzhen, China (HIPRO20160804)
This article is maintained by: Elsevier
Article Title: Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing
Journal Title: Corrosion Science
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.corsci.2018.05.020
Content Type: article
Copyright: © 2018 Elsevier Ltd. All rights reserved.