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Fracture analysis in piezoelectric semiconductors under a thermal load

Crossref DOI link: https://doi.org/10.1016/j.engfracmech.2014.05.011

Published Print: 2014-08

Update policy: https://doi.org/10.1016/elsevier_cm_policy

Authors

Sladek, J.

Sladek, V.

Pan, E.

Wünsche, M.
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This article is maintained by: Elsevier

Article Title: Fracture analysis in piezoelectric semiconductors under a thermal load

Journal Title: Engineering Fracture Mechanics

CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.engfracmech.2014.05.011

Content Type: article

Copyright: Copyright © 2014 Elsevier Ltd. All rights reserved.