Sharma, Tanu
Brüning, Ralf
Nguyen, Tang Cam Lai
Bernhard, Tobias
Brüning, Frank
Funding for this research was provided by:
Canada Foundation for Innovation
Atlantic Innovation Fund
This article is maintained by: Elsevier
Article Title: Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness
Journal Title: Microelectronic Engineering
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.mee.2015.05.003
Content Type: article
Copyright: Copyright © 2015 Published by Elsevier B.V.