Kim, Yeonsung http://orcid.org/0000-0002-2309-6071
Park, Ah-Young
Kao, Chin-Li
Su, Michael
Black, Bryan
Park, Seungbae
This article is maintained by: Elsevier
Article Title: Prediction of deformation during manufacturing processes of silicon interposer package with TSVs
Journal Title: Microelectronics Reliability
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.microrel.2016.07.153
Content Type: article
Copyright: © 2016 Elsevier Ltd. All rights reserved.