Dornic, N.
Ibrahim, A.
Khatir, Z.
Tran, S.H.
Ousten, J.-P.
Ewanchuk, J.
Mollov, S.
This article is maintained by: Elsevier
Article Title: Analysis of the degradation mechanisms occurring in the topside interconnections of IGBT power devices during power cycling
Journal Title: Microelectronics Reliability
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.microrel.2018.07.041
Content Type: article
Copyright: © 2018 Elsevier Ltd. All rights reserved.