Flowers, Patrick F.
Reyes, Christopher
Ye, Shengrong
Kim, Myung Jun
Wiley, Benjamin J.
Funding for this research was provided by:
NSF CAREER (DMR-1253534)
NSF (ECCS-1344745)
This article is maintained by: Elsevier
Article Title: 3D printing electronic components and circuits with conductive thermoplastic filament
Journal Title: Additive Manufacturing
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.addma.2017.10.002
Content Type: article
Copyright: © 2017 Elsevier B.V. All rights reserved.