Kobayashi, Yoshio
Maeda, Takafumi
Yasuda, Yusuke
Morita, Toshiaki
This article is maintained by: Elsevier
Article Title: Metal–metal bonding process using cuprous oxide nanoparticles
Journal Title: Journal of Materials Research and Technology
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.jmrt.2016.05.007
Content Type: article
Copyright: © 2016 Brazilian Metallurgical, Materials and Mining Association. Published by Elsevier Editora Ltda.