Skuriat, R.
Li, J.F.
Agyakwa, P.A.
Mattey, N.
Evans, P.
Johnson, C.M.
This article is maintained by: Elsevier
Article Title: Degradation of thermal interface materials for high-temperature power electronics applications
Journal Title: Microelectronics Reliability
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.microrel.2013.05.011
Content Type: article
Copyright: Copyright © 2013 The Authors. Published by Elsevier Ltd.