Etching mechanism of the single-step through-silicon-via dry etch using SF6/C4F8 chemistry
Crossref DOI link: https://doi.org/10.1116/1.4885500
Published Online: 2014-06-26
Published Print: 2014-07-01
Update policy: https://doi.org/10.1063/aip-crossmark-policy-page
Ouyang, Zihao
Ruzic, D. N.
Kiehlbauch, Mark
Schrinsky, Alex
Torek, Kevin