Flexible electronics under strain: a review of mechanical characterization and durability enhancement strategies
Crossref DOI link: https://doi.org/10.1007/s10853-015-9643-3
Published Online: 2015-12-21
Published Print: 2016-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Harris, K. D.
Elias, A. L.
Chung, H.-J.
Text and Data Mining valid from 2015-12-21