Grain boundary character distribution in electroplated nanotwinned copper
Crossref DOI link: https://doi.org/10.1007/s10853-016-0670-5
Published Online: 2016-12-22
Published Print: 2017-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ratanaphan, Sutatch
Raabe, Dierk
Sarochawikasit, Rajchawit
Olmsted, David L.
Rohrer, Gregory S.
Tu, K. N.
License valid from 2016-12-22