Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding
Crossref DOI link: https://doi.org/10.1007/s10854-016-4366-z
Published Online: 2016-01-27
Published Print: 2016-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shao, Huakai http://orcid.org/0000-0002-2484-4916
Wu, Aiping
Bao, Yudian
Zhao, Yue
Zou, Guisheng
Funding for this research was provided by:
National Natural Science Foundation of China (No. 51375260)
License valid from 2016-01-27