Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly
Crossref DOI link: https://doi.org/10.1007/s11664-016-4427-3
Published Online: 2016-03-24
Published Print: 2016-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Youngsoon
Lee, Seyong
Shin, Ji-won
Paik, Kyung-Wook
Text and Data Mining valid from 2016-03-24