Funding for this research was provided by:
Ministry of Education, Science and Technology (2017M3C1B5018727)
This article is maintained by: Elsevier
Article Title: Examination of high-temperature mechanisms and behavior under compression and processing maps of pure copper
Journal Title: Journal of Materials Research and Technology
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/J.JMRT.2019.11.036
Content Type: article
Copyright: © 2019 The Authors. Published by Elsevier B.V.