Crossmark

Pattern dependent profile distortion during plasma etching of high aspect ratio features in SiO2

Crossref DOI link: https://doi.org/10.1116/1.5132800

Published Online: 2020-01-08

Published Print: 2020-03-01

Update policy: https://doi.org/10.1063/aip-crossmark-policy-page

Authors

Huang, Shuo https://orcid.org/0000-0002-3055-646X
Shim, Seungbo

Nam, Sang Ki

Kushner, Mark J. https://orcid.org/0000-0001-7437-8573
Funding

Funding for this research was provided by:

Samsung Electronics Ltd.

US Department of Energy (DE-SC0001319)

US Department of Energy (DE-SC0014132 and DE-SC0020232)