Thermal atomic layer etching of silicon nitride using an oxidation and “conversion etch” mechanism
Crossref DOI link: https://doi.org/10.1116/1.5140481
Published Online: 2020-02-14
Published Print: 2020-03-01
Update policy: https://doi.org/10.1063/aip-crossmark-policy-page
Abdulagatov, Aziz I.
George, Steven M. https://orcid.org/0000-0003-0253-9184
Funding for this research was provided by:
Defense Advanced Research Projects Agency (W911NF-13-1-004)
Accepted Manuscript valid from 2021-02-14
