Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Crossref DOI link: https://doi.org/10.1115/1.4047846
Published Online: 2020-08-17
Published Print: 2020-09-01
Update policy: https://doi.org/10.1115/crossmarkpolicy-asme
Jung, Ki Wook
Cho, Eunho
Lee, Hyoungsoon
Kharangate, Chirag
Zhou, Feng
Asheghi, Mehdi
Dede, Ercan M.
Goodson, Kenneth E.
Version of Record valid from 2020-08-17