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Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Crossref DOI link: https://doi.org/10.1115/1.4047847

Published Online: 2020-08-17

Published Print: 2020-09-01

Update policy: https://doi.org/10.1115/crossmarkpolicy-asme

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