Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Crossref DOI link: https://doi.org/10.1115/1.4049293
Published Online: 2021-02-22
Published Print: 2021-06-01
Update policy: https://doi.org/10.1115/crossmarkpolicy-asme
Warzoha, Ronald J.
Wilson, Adam A.
Donovan, Brian F.
Donmezer, Nazli
Giri, Ashutosh
Hopkins, Patrick E.
Choi, Sukwon
Pahinkar, Darshan
Shi, Jingjing
Graham, Samuel
Tian, Zhiting
Ruppalt, Laura
Version of Record valid from 2021-02-22