Microfluidic cooling for high-heat-flux chips: Thermal-path compression, bottleneck migration and near-junction limits
Crossref DOI link: https://doi.org/10.70401/tx.2026.0024
Published Online: 2026
Update policy: https://doi.org/10.70401/science_exploration_crossmark_policy
Wei, Junjie
Lin, Shuyuan
Fu, Junhao
Zhao, Zhangchi
Wei, Ning https://orcid.org/0000-0001-6448-4137
