Heterogeneous Integration of 2D Materials and Devices on a Si Platform
Crossref DOI link: https://doi.org/10.1007/978-3-319-90385-9_3
Published Online: 2018-08-21
Published Print: 2019
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Nourbakhsh, Amirhasan
Yu, Lili
Lin, Yuxuan
Hempel, Marek
Shiue, Ren-Jye
Englund, Dirk
Palacios, Tomás
License valid from 2018-08-21
