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Uncovering the influence of common nonmetallic impurities on the stability and strength of a Σ5 (310) grain boundary in Cu

Crossref DOI link: https://doi.org/10.1016/j.actamat.2018.01.058

Published Print: 2018-04

Update policy: https://doi.org/10.1016/elsevier_cm_policy

Authors

Huang, Zhifeng

Chen, Fei

Shen, Qiang

Zhang, Lianmeng

Rupert, Timothy J.
Funding

Funding for this research was provided by:

U.S. Army Research Office (W911NF-16-1-0369)

National Natural Science Foundation of China (51472188)

National Natural Science Foundation of China (51521001)

Natural Research Funds of Hubei Province (2016CFB583)

Fundamental Research Funds for the Central Universities in China

“111” project (B13035)
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Text and Data Mining valid from 2018-04-01

Text and Data Mining valid from 2018-04-01

Accepted Manuscript valid from 2019-02-08
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This article is maintained by: Elsevier

Article Title: Uncovering the influence of common nonmetallic impurities on the stability and strength of a Σ5 (310) grain boundary in Cu

Journal Title: Acta Materialia

CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.actamat.2018.01.058

Content Type: article

Copyright: © 2018 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.