Gao, Rui
Jin, Miaomiao https://orcid.org/0000-0002-3543-4082
Han, Fei
Wang, Baoming
Wang, Xianping https://orcid.org/0000-0001-9903-7839
Fang, Qianfeng
Dong, Yanhao https://orcid.org/0000-0003-1224-1015
Sun, Cheng https://orcid.org/0000-0003-4104-8898
Shao, Lin https://orcid.org/0000-0002-5703-1153
Li, Mingda
Funding for this research was provided by:
U.S. Department of Energy (1908085QA42)
U.S. Department of Energy (51801194)
U.S. Department of Energy (51971213)
U.S. Department of Energy (51771181)
U.S. Department of Energy (51971212)
U.S. Department of Energy (U1967211)
U.S. Department of Energy (1908085QA42)
U.S. Department of Energy (51801194)
U.S. Department of Energy (51971213)
U.S. Department of Energy (51771181)
U.S. Department of Energy (51971212)
U.S. Department of Energy (U1967211)
Natural Science Foundation of Anhui Province (1908085QA42)
Natural Science Foundation of Anhui Province (51801194)
Natural Science Foundation of Anhui Province (51971213)
Natural Science Foundation of Anhui Province (51771181)
Natural Science Foundation of Anhui Province (51971212)
Natural Science Foundation of Anhui Province (U1967211)
Office of Nuclear Energy (1908085QA42)
Office of Nuclear Energy (51801194)
Office of Nuclear Energy (51971213)
Office of Nuclear Energy (51771181)
Office of Nuclear Energy (51971212)
Office of Nuclear Energy (U1967211)
National Natural Science Foundation of China (1908085QA42)
National Natural Science Foundation of China (51801194)
National Natural Science Foundation of China (51971213)
National Natural Science Foundation of China (51771181)
National Natural Science Foundation of China (51971212)
National Natural Science Foundation of China (U1967211)
This article is maintained by: Elsevier
Article Title: Superconducting Cu/Nb nanolaminate by coded accumulative roll bonding and its helium damage characteristics
Journal Title: Acta Materialia
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.actamat.2020.07.031
Content Type: article
Copyright: © 2020 Published by Elsevier Ltd on behalf of Acta Materialia Inc.