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One-step electrodeposition of copper on conductive 3D printed objects

Crossref DOI link: https://doi.org/10.1016/j.addma.2019.03.016

Published Print: 2019-05

Update policy: https://doi.org/10.1016/elsevier_cm_policy

Authors

Kim, Myung Jun https://orcid.org/0000-0002-9056-4904
Cruz, Mutya A.

Ye, Shengrong

Gray, Allen L.

Smith, Gabriel L.

Lazarus, Nathan

Walker, Christopher J.

Sigmarsson, Hjalti H. https://orcid.org/0000-0001-8636-091X
Wiley, Benjamin J.
Funding

Funding for this research was provided by:

National Science Foundation CAREER

National Science Foundation STTR Phase I (1721644)

Department of Energy’s Kansas City National Security Campus, operated by Honeywell Federal Manufacturing & Technologies, LLC
License Information

Text and Data Mining valid from 2019-05-01

Text and Data Mining valid from 2019-05-01

Accepted Manuscript valid from 2020-03-24
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This article is maintained by: Elsevier

Article Title: One-step electrodeposition of copper on conductive 3D printed objects

Journal Title: Additive Manufacturing

CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.addma.2019.03.016

Content Type: article

Copyright: © 2019 Elsevier B.V. All rights reserved.