He, Lewei
Chen, Bingzhi
Liu, Qimin
Chen, Hao
Li, Hua https://orcid.org/0000-0003-4899-9477
Chow, Wai Tuck
Tang, Jiaoning
Du, Zhibin
He, Yang
Pan, Jiahui https://orcid.org/0000-0002-7576-6743
This article is maintained by: Elsevier
Article Title: A quasi-exponential distribution of interfacial voids and its effect on the interlayer strength of 3D printed concrete
Journal Title: Additive Manufacturing
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.addma.2024.104296
Content Type: article
Copyright: © 2024 The Authors. Published by Elsevier B.V.